Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Number of Rows 3 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 MICM | Multiple Contact Types Without | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 3.81 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Retention