117249-7 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Gold Flash | Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.9212 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness .76 MICM | Contact Orientation Straight | Dimensions: