1217133-1 - TE Connectivity
Description: Contact Features: Contact Underplating Material Thickness 2.54 MICM | Mating Tab Width .187 INCH | PCB Terminal Type Tab | Terminal Plating Material Tin | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Underplating Material Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | Terminal Orientation Straight | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Underplating Material Thickness 50 MICIN | Mating Tab Thickness .032 INCH | Mating Tab Thicknes