1217136-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 3.81 MICM | Mating Tab Thickness .8 MM | Mating Tab Width 6.35 MM | Contact Underplating Material Copper | Contact Underplating Material Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 150 MICIN | PCB Terminal Type Tab | Contact Underplating Material Thickness 1.27 MICM | Mating Tab Thickness .031 INCH | Terminal Plating Material Tin | Contact Underplating Material Thickness 100 MICIN