1217566-2 - TE Connectivity

Description: Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Mating Tab Thickness .81 MM | Contact Underplating Material Copper or Nickel | Contact Underplating Material Thickness 100 MICIN | Mating Tab Width 6.35 MM | Mating Tab Thickness .032 INCH | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Mating Tab Width .25 INCH | Terminal Size 6.35 | Contact