1586041-2 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Dimension