1586530-2 - TE Connectivity

Description: Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 1.18 MICM | Contact Mating Area Plating Material Thickness .03 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Dimensions: Product Length