1586953-1 - TE Connectivity

Description: Configuration Features: Number of Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without