163083-2 - TE Connectivity

Description: Contact Features: Wire Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 3 MICIN | Mating Pin Diameter .062 INCH | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Contact Base Material Brass | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | C