Description: Contact Features: Contact Mating Area Plating Material Thickness 10 MICIN | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Mating Pin Diameter 1.02 MM | Contact Underplating Material Thickness 50 MICIN | Contact Base Material Copper | Contact Type Pin | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Underplating Material Nickel | Contact Size Size 20 | Contact Mating Area Plating Material Thickness