1650161-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 10 MICIN | Contact Retention Within Housing Without | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .25 MICM | Contact Base Material Copper | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | Mating Pin Diameter .04 INCH | Mating Pin Diameter 1.02 MM | Contact Underplating Material Thickness 50 MICIN