1650226-1 - TE Connectivity
Description: Contact Features: Mating Pin Diameter 1.02 MM | Contact Type Pin | Contact Underplating Material Thickness 1 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 40 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Wire Contact Termination Area Plating Material Gold | PCB Cont