1650283-1 - TE Connectivity
Description: Contact Features: Contact Base Material Copper | Mating Pin Diameter 1.02 MM | PCB Contact Termination Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 40 MICIN | PCB Contact Termination Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | Contact Orientation Straight | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rat