1658670-3 - TE Connectivity

Description: Contact Features: Contact Underplating Material Nickel | Mating Pin Diameter .76 MM | Mating Pin Diameter .03 INCH | PCB Contact Termination Area Plating Material Tin | Contact Base Material Brass | Contact Type Pin | Contact Current Rating (Max) 1.9 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Size Size 22 | Contact Mating Area Plating Material Gold Flash | Dimensions: Wire Size .08 – .4 MMSQ | Compatible Insulation Diameter Range .03 – .04 INCH | Wire Size 28 – 22 AWG | C