166500-4 - TE Connectivity

Description: Contact Features: Contact Orientation Straight | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area Plating Material Gold Flash | Dimensions: Wire Size .21 – .51 MMSQ | Wire Size 24 – 20 AWG | Compatible Insulation Diameter Range .91 – 1.37 MM | Mechanical Attachment: PCB Mount Retention Without | Contact Retention Type Within Housing Snap-In | Wire Insulation Supp