170338-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Underplating Material Copper | Terminal Size Standard | PCB Terminal Type PCB Pin | Terminal Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness .8 MICM | Contact Underplating Material Thickness 19.68 MICIN | Terminal Orientation Straight | Contact Underplating Material Thickness .5 MICM | Dimensions: PCB Hole Diameter .072 INCH | Compatible Insulation Diameter (Max) 2.79 MM | Wire Size .3 – .9 MMSQ