174520-1 - TE Connectivity
Description: Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Pin | Dimens