Description: Configuration Features: Number of Positions 52 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Gold Flash | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Dimensions: Stack Height 9.9 MM | Stack Height .39 INCH | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Industry Standards: Bus Type Mini PCI Express | Operation/Application: Circuit Application Signal | Packaging Features: Packa