178495-9 - TE Connectivity

Description: Configuration Features: Number of Positions 2 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Rows 1 | Number of Signal Positions 0 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Thickness 39.37 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Type Tab | Electrical Charact