Description: Configuration Features: Number of Rows 4 | Mating & Unmating Configuration Sequencing | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Positions 30 | Number of Signal Positions 24 | Contact Features: Contact Type Receptacle | Contact Underplating Material Thickness 4.19 MICM | Contact Mating Area Plating Material Thickness .076 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Power Contact Base Material Tin | Contact Mating Area Plati