1892714-2 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Power Contact Base Material Tin | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thic