Description: Configuration Features: Number of Power Positions 10 | Number of Positions by Circuit Application 25/Signal, 10/DC Power | Number of Positions 85 | PCB Mount Orientation Vertical | Number of Rows 5 | Number of Signal Positions 25 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 17 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness .5 MICM | Contact Retention Within Housing With | Contact Mating Area Plating Materia