1969804-1 - TE Connectivity
Description: Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Housing Features: Housing C