1969809-1 - TE Connectivity

Description: Configuration Features: Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | Housing Features: Housing M