Description: Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | C