Description: Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB