Description: Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Layout Inline |