2-1586041-4 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix |