2-2129710-1 - TE Connectivity
Description: Body Features: Frame Style C Shape | Configuration Features: Number of Positions 1824 | Grid Spacing .9906 x .8585 MM | Grid Spacing .039 x .0338 INCH | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | IC Socket Type LGA 3647 | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Housing Features: Housing Color Black | Centerline (Pitch) .99 MM | Centerline (Pitch) .039 INCH | Housing Material High Temperature Therm