2-2129710-7 - TE Connectivity
Description: Body Features: Frame Style C Shape | Configuration Features: Grid Spacing .039 x .0338 INCH | Number of Positions 1824 | Grid Spacing .9906 x .8585 MM | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | IC Socket Type LGA 3647 | Housing Features: Centerline (Pitch) .99 MM | Housing Color Black | Housing Material High Temperature Thermoplastic | Centerline (Pitch) .