2-2129710-8 - TE Connectivity
Description: Body Features: Frame Style C Shape | Configuration Features: Grid Spacing .9906 x .8585 MM | Number of Positions 1823 | Grid Spacing .039 x .0338 INCH | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | IC Socket Type LGA 3647 | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .039 INCH | Centerline (Pitch) .86 MM | Housing Color Black | Centerline (Pitch) .99 MM | Housing Mat