2-2822979-3 - TE Connectivity

Description: Body Features: Frame Style Square | Configuration Features: Grid Spacing .9906 x .8585 MM | Number of Positions 3647 | Grid Spacing .039 x .0338 INCH | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | IC Socket Type LGA 3647 | Contact Base Material Copper Alloy | Housing Features: Centerline (Pitch) .99 MM | Centerline (Pitch) .039 INCH | Centerline (Pitch) .86 MM | Centerline (Pitch) .034 INCH | Hou