2-644752-0 - TE Connectivity

Description: Configuration Features: Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 7 AMP | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Mating Post Length .4 INCH |