201145-4 - TE Connectivity

Description: Body Features: Shell Plating Material Gold | Shell Base Material Brass | Contact Features: Contact Base Material Beryllium Copper | Contact Mating Retention Without | Contact Current Rating (Max) 7.5 AMP | Contact Orientation Straight | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Mating Area Plating Material Gold | Electrical Characteristics: Impedance Options Non-Matched | Operation/Application: Circuit Application Power | Other: Dielectric Material Polypropylene |