205089-2 - TE Connectivity

Description: Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Type Pin | Mating Pin Diameter .04 MM | Contact Current Rating (Max) 7.5 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Size Size 20 | Dimensions: Compatible Insulation Diameter Range 1.83 INCH | Wire Size 24 – 20 AWG | Compatible Insulation Diameter Range .07 MM | Wire Size .2 – .6 MMSQ | Identification Marking: Contact Color Code Blu