Part Image

206495-3 - TE Connectivity

Description: Contact Features: Mating Pin Diameter .03 MM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Size Size 22 | Contact Underplating Material Copper | Contact Type Pin | Dimensions: Wire Size .08 – .15 MMSQ | Compatible Insulation Diameter Range .05 MM | Compatible Insulation Diameter Range 1.38 INCH | Wire Size 28 – 26

Download 206495-3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
    Zoom
    Zoom Full
    Middle click on footprint to measure