213662-2 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Plating Material Gold | Mating Pin Diameter .142 INCH | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness .76 MICM | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Contact Type Pin | Contact Current Rating (Max) 31 AMP | Contact Underplating Material Thickness 2 – 3 MICM | Contact Underplating Material T