213843-4 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Mating Pin Diameter .125 INCH | Contact Size Size 8 | Contact Retention Within Housing With | Mating Pin Diameter 3.18 MM | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Finish Semi-Bright | Con