213845-2 - TE Connectivity

Description: Contact Features: Contact Orientation Straight | Contact Underplating Material Thickness 2 – 3 MICM | Contact Size Size 8 | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Wire Contact Termination Area Plating Thickness 1 MICIN | Contact Base Material Copper | Contact Retention Within Housing With | Mating Pin Diameter 3.18 MM | Wire