213845-5 - TE Connectivity

Description: Contact Features: Contact Base Material Copper | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Silver | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Pin Diameter 3.18 MM | Contact Mating Area Plating Material Finish Semi-Bright | Contact Underplating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Plating Materia