Part Image

213847-1 - TE Connectivity

Description: Contact Features: Mating Pin Diameter 3.18 MM | Contact Base Material Copper | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Contact Mating Area Plating Material Finish Semi-Bright | Contact Retention Within Housing With | Contact Size Size 8 | Contact Underplating Material Thickness 2 – 3 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Material Silver | Wire Contact Termination Area Plating Material Finish Semi-Bright | Wi

Download 213847-1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
Zoom
Zoom Full
Drag mouse to rotate
Mouse wheel to zoom