213847-2 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Wire Contact Termination Area Plating Thickness 1 MICIN | Wire Contact Termination Area Plating Thickness .02 MICM | Contact Base Material Copper | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 2 – 3 MICM | Mating Pin Diameter 3.18 MM | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Contact Current Rating (Max) 50 AMP | Wire Contact T