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213847-4 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 2 – 3 MICM | Mating Pin Diameter .125 INCH | Contact Retention Within Housing With | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 1 MICIN | Contact Orientation Straight | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Mating Pin Diameter 3.18 MM | Contact Underplating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Pla

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