2149730-8 - TE Connectivity

Description: Body Features: Heat Sink Height 6.5 MM | Heat Sink Height Class SAN | Heat Sink Style Fin | Heat Sink Height .256 INCH | Configuration Features: Number of Ports 4 | Port Matrix Configuration 1 x 4 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ Enhanced |