2170191-1 - TE Connectivity

Description: Body Features: Heat Sink Height Class Custom | Heat Sink Style Pin | Heat Sink Height .13 INCH | Configuration Features: Port Matrix Configuration 1 x 4 | Number of Ports 4 | Dimensions: PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ Enhanced | Circuit Application Signal | Heat Sink Compatible Yes | Other: EMI Containment Feature Type Internal/External EMI Spring