2180490-1 - TE Connectivity

Description: Configuration Features: Number of Positions 4 | Number of Rows 2 | Board-to-Board Configuration Perpendicular | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Board-to-Board Configuration Co-Planar | Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating