2214574-4 - TE Connectivity

Description: Configuration Features: Number of Positions 152 | Number of Ports 4 | Number of Rear EONs per Port Column 0 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | Electrical Characteristics: Data Rate (Max) 14 GBS