2227668-2 - TE Connectivity

Description: Configuration Features: Number of Ports 6 | Port Matrix Configuration 2 x 3 | Number of Rear EONs per Port Column 0 | Number of Positions 228 | Contact Features: Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness