2227670-2 - TE Connectivity

Description: Configuration Features: Number of Positions 152 | Number of Rear EONs per Port Column 3 | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne