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225679-E - TE Connectivity

Description: Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Copper Alloy | Contact Current Rating (Max) 250 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin (Sn) | Contact Mating Area Plating Material Finish Matte | Contact Type Pin | Contact Mating Area Plating Material Thickness 78.74 – 236.22 MICIN | Contact Underplating Material Copper | PCB Contact Termination Area Plating Material Finish Ma

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